Other softwares for MEMS simulation

APLAC Solutions Corp.

AWR-APLAC develops and markets simulation and analysis software for analog and RF designers. The software is specially designed to meet the challenges of mobile communications. APLAC software is used by both multi-national companies as well as small design agencies to solve their most challenging simulation problems. APLAC enhances the cost effectiveness and shortens the design time. APLAC's capabilities range from integrated circuits to circuit board and system level design, from direct current to RF and microwave frequencies.

Bay Technology

Supplier of LinkCAD, a CAD Translation program for translation of GDS-II, DXF, Gerber, PostScript & CIF. Used for moving files from one program to another as you step through the manufacturing processes. Baytech is also a supplier of IE3D an Electromagnetic Simulation tool for analysis of MEMS circuits.

CFD Research Corporation (CFDRC)

Provides advanced software tools for modeling, simulation, and design of MEMS. Their software has been used for the analysis of a wide variety of physical phenomena such as fluid flow, heat transfer, combustion, and fluid-structure interaction. Industrial applications include MEMS, electronics packaging, semiconductor turbomachinery, and automotive engineering.

COMSOL Inc.

COMSOL MEMS Module addresses design issues that arise in the micro-world. It models physical phenomena in actuators and sensors plus microfluidic and small piezoelectric devices. Because MEMS Module is built over COMSOL Multiphysics platform it can handle electromagnetic- structural, thermal-structural, fluid-structure (FSI), electromagnetic-fluid interactions or any other combination of multiphysical couplings needed in the MEMS world.

Dolphin Integration

Our current mission is to supply our worldwide customers with fault-free, high-yield and reliable sets of CMOS Virtual Components, together with engineering assistance and product evolution customized to their needs.

Flow Science

Flow Science offers FLOW-3D, a leader free surface modeling accuracy, especially in cases where surface tension is dominant, as with microscale flows. With its fully-featured solver, FLOW-3D can be used to simulate a wide range of MEMS problems.

Hibbitt, Karlsson & Sorensen, Inc.

Produces the ABAQUS http://www.hks.com/products/ products for finite-element simulation.
ABAQUS/Standard http://www.hks.com/products/p_abstandard.html is a general purpose finite element program designed specifically for advanced structural and heat transfer analysis.
ABAQUS/Explicit http://www.hks.com/products/p_abexplicit.html is a finite element program designed specifically to serve advanced, nonlinear continuum and structural analysis needs.

Hygrometrix, Inc.

We design and manufacture high precision humidity and vapor sensing solutions for aerospace, industrial, research, environmental and scientific customers around the world

microTEC

microTEC offer the customer specific development and contract manufacturing of components, microsystems and microstructures, as prototyping as well as batch production.

Moxtek

Innovative x-ray components and optical polarizers x-ray products and optical polarizers
MOXTEK®, Inc. was founded in 1986 with technology jointly developed with Brigham Young University. Today, MOXTEK is a leader in the development and manufacturing of X-ray and optical components. Moxtek is well known for advanced technology, innovative solutions, and excellent customer service.

National Cheng Kung University

The Department of Mechanical Engineering at National Cheng-Kung University (NCKU) has been established since 1931, and is the oldest and the most renowned mechanical engineering institutes in Taiwan. Our alumni and alumnus occupy important positions in Taiwan’s industries, business, and governmental institution. In addition, numerous faculty members of Taiwan and world’s leading universities are also graduated from this department. A local survey reveals that alumni from NCKU have being the most welcome employees by Taiwan business companies. Each year, 150 undergraduate students, 171 master students (including 20 part-time students), and 60 Ph.D. students are enrolled in this department each year. Currently, this department is consisted of 47 full time professors, 11 adjunct professors, 600 undergraduates, 300 master students, and 150 Ph.D. students.

Pragmatic Instruments, Inc.

Pragmatic Instruments is a San Diego-based manufacturer of Arbitrary Waveform Generators, Voltage Standards, MEMS Driver Systems, and other custom signal generation products for novel test applications.

SIMODE/QSIMODE

The simulation package SIMODE/QSIMODE contains complete simulation support for orientation dependent etching. It is developed by GEMAC mbH http://www.gemac-chemnitz.de/ and the University of Chemnitz.

The MathWorks, Inc.

produces the MATLAB package, which may be used for general system simulation and visualization applications.

Top-Vu Technology,Inc.

from: http://www.mems-exchange.org/

ANSYS and MEMS

Microsystems (MEMS) Industry
Micro Electro Mechanical Systems (MEMS) technology is at the center of a rapidly emerging industry combining many different engineering disciplines & physics: electrical, electronic, mechanical, optical, material, chemical, and fluidic engineering disciplines. As the smallest commercially produced "machines," MEMS devices are similar to traditional sensors and actuators although much, much smaller. e.g. Complete systems are typically a few millimeters across, with individual devices and features of the order of 1-100 micrometers across.

Example of a MEMS switch, courtesy FEM-ware GmbHRF device. The response time of an electrostatic actuated beam is simulated. Actuation voltage, mechanical contact and fluid damping effects are simultaneously accommodated using our reduced order modellig (ROM) technique.

Microsystem Analysis Features

ANSYS Multiphysics has an extremely broad physics capability directly applicable to many areas of microsystem design. Coupling between these physics enables accurate, real world simulation of devices such as electrostatic driven comb drives. i.e.

• The ability to compute fluid structural damping effects is critical in determining the switching response time of devices such as micromirrors.




• Electro-thermal-structural effects are employed in thermal actuators.




• Fluid (CFD) capabilities are used to compute flow and free surface droplet formation useful in the design of ink-jet printer nozzles, and lab-on-chip applications.

The following diagram explains how ANSYS Multiphysics capabilities fits into your Microsystem/MEMS design process:

A sample of the features included in ANSYS Multiphysics are listed below:

• Structural static, modal, harmonic, transient mechanical deformation.
  




• Large deformation structural nonlinearities.
  




• Full contact with friction and thermal contact.
  




• Linear & non linear materials.
  




• Buckling, creep.
  




• Material properties: Temperature dependent, isotropic, orthotropic, anisotropic.
  




• Loads/Boundary conditions: Tabular, polynomial and function of a function loads.
  




• Plasticity, viscoplasticity, phase change.
  




• Electrostatics & Magnetostatics.
  




• Low Frequency Electromagnetics.
  




• High Frequency Electromagnetics. (Full wave, frequency domain).
  




• Circuit coupling - voltage & current driven.
  




• Acoustic - Structural coupling.
  




• Electrostatic-structural coupling.
  




• Capacitance and electrostatic force extraction.
  




• Fluid-Structural capability to evaluate damping effects on device response time.
  




• Microfluidics: Newtonian & non Newtonian continuum flow
  




• Free Surface VOF with temperature dependent surface tension.
  




• Charged particle tracing in electrostatic and magnetostatic fields.
  




• Electro-thermal-structural coupling.
  




• Piezoelectric & Piezoresistive transducers: Direct coupled structural-electric physics. Full isotropic, orthotropic parameters.
  




• Advanced themrolelectirc effect such as Seebeck, Peltier & thermocouple.
  

ANSYS MEMS Applications Overview

ANSYS Multiphysics can be applied to a broad range of Microsystem/MEMS analysis. The following table shows the analysis capability relevant for a range of applications. Select the application name or click the link in the "at a glance" section to the right to view a more detailed description.

from: http://www.ansys.com/

University of Alberta - ANSYS Tutorials

These pages include some ANSYS examples including:
static/dynamic structural analysis (both linear and non-linear), heat transfer and fluid problems, as well as acoustic and electromagnetic problems.

http://www.mece.ualberta.ca/tutorials/ansys/