Use MatWeb's search instructions to help you find the materials and material property data you need on metals, ceramics, and plastics.
ANSYS Data Downloads
Users of ANSYS FEA software can now export technical datasheets from MatWeb's collection in the ANSYS material library format. This is the new feature of our Premium membership available for only $74.95 for a one year subscription! A complete list of Premium features and membership options is available here. Users can create and export libraries of 20 materials at a time in ANSYS library format (XML) from MatWeb's collection of over 59,000 material data sheets. The appropriate property values in the correct units are automatically added to the XML file with ease and accuracy.
http://asia.matweb.com/help/ansys_intro.asp
2007-10-10
A FEM course (ANSYS)
Finite element analysis (FEA) is a powerful engineering tool that can solve many kinds of engineering problems to as high a degree of precision as necessary. Mechanical, fluid, heat transfer, electrical, and magnetic problems either separately or in combination can be solved by FEA. If a problem can be described by a set of differential equations, it can generally be solved by FEA.
This course winds a path between learning the principles of FEA and using the computer programs Ansys and Matlab to solve some simple engineering problems by FEA. By the end of the course, you will be able to solve very complex engineering problems by FEA.
Instead of a textbook, there are about 50 web pages providing information for this class. As a student in MENG 421, you need to study the material on all these web pages. This home page provides links to key pages such as Ansys and Assignments, which in turn link to many other web pages.
This class requires much time and patience, therefore please allow sufficient time for the assignments. Do not wait until the last minute to start them. Furthermore, you must have a good working knowledge of Microsoft Windows 2000 to run Ansys, the finite element program used for this course. Matlab is also used extensively.
Any of the campus networked PCs can be used to do the assignments. In addition, there are networked PCs in the Mechanical Engineering computer room that can be used.
There are several very good FEA books on reserve at the library for this course. Be sure that you read at least the first chapter of each as soon as possible.
http://infohost.nmt.edu/~es421/homepage.htm
This course winds a path between learning the principles of FEA and using the computer programs Ansys and Matlab to solve some simple engineering problems by FEA. By the end of the course, you will be able to solve very complex engineering problems by FEA.
Instead of a textbook, there are about 50 web pages providing information for this class. As a student in MENG 421, you need to study the material on all these web pages. This home page provides links to key pages such as Ansys and Assignments, which in turn link to many other web pages.
This class requires much time and patience, therefore please allow sufficient time for the assignments. Do not wait until the last minute to start them. Furthermore, you must have a good working knowledge of Microsoft Windows 2000 to run Ansys, the finite element program used for this course. Matlab is also used extensively.
Any of the campus networked PCs can be used to do the assignments. In addition, there are networked PCs in the Mechanical Engineering computer room that can be used.
There are several very good FEA books on reserve at the library for this course. Be sure that you read at least the first chapter of each as soon as possible.
http://infohost.nmt.edu/~es421/homepage.htm
2007-10-09
Instruction to ANSYS.net
This web site give us some useful information about ANSYS simulation. The following are its collections
input file library
macro library
tips & tricks
tech papers
undocumented
resources
ansys news
xansys archives
useful links
animation gallery
customer portal
engineering
tools & utilities
material props
web resources
book references
general info
about this site
website updates
rss feed
input file library
macro library
tips & tricks
tech papers
undocumented
resources
ansys news
xansys archives
useful links
animation gallery
customer portal
engineering
tools & utilities
material props
web resources
book references
general info
about this site
website updates
rss feed
Other softwares for MEMS simulation
APLAC Solutions Corp.
AWR-APLAC develops and markets simulation and analysis software for analog and RF designers. The software is specially designed to meet the challenges of mobile communications. APLAC software is used by both multi-national companies as well as small design agencies to solve their most challenging simulation problems. APLAC enhances the cost effectiveness and shortens the design time. APLAC's capabilities range from integrated circuits to circuit board and system level design, from direct current to RF and microwave frequencies.
Bay Technology
Supplier of LinkCAD, a CAD Translation program for translation of GDS-II, DXF, Gerber, PostScript & CIF. Used for moving files from one program to another as you step through the manufacturing processes. Baytech is also a supplier of IE3D an Electromagnetic Simulation tool for analysis of MEMS circuits.
CFD Research Corporation (CFDRC)
Provides advanced software tools for modeling, simulation, and design of MEMS. Their software has been used for the analysis of a wide variety of physical phenomena such as fluid flow, heat transfer, combustion, and fluid-structure interaction. Industrial applications include MEMS, electronics packaging, semiconductor turbomachinery, and automotive engineering.
COMSOL Inc.
COMSOL MEMS Module addresses design issues that arise in the micro-world. It models physical phenomena in actuators and sensors plus microfluidic and small piezoelectric devices. Because MEMS Module is built over COMSOL Multiphysics platform it can handle electromagnetic- structural, thermal-structural, fluid-structure (FSI), electromagnetic-fluid interactions or any other combination of multiphysical couplings needed in the MEMS world.
Dolphin Integration
Our current mission is to supply our worldwide customers with fault-free, high-yield and reliable sets of CMOS Virtual Components, together with engineering assistance and product evolution customized to their needs.
Flow Science
Flow Science offers FLOW-3D, a leader free surface modeling accuracy, especially in cases where surface tension is dominant, as with microscale flows. With its fully-featured solver, FLOW-3D can be used to simulate a wide range of MEMS problems.
Hibbitt, Karlsson & Sorensen, Inc.
Produces the ABAQUS http://www.hks.com/products/ products for finite-element simulation.
ABAQUS/Standard http://www.hks.com/products/p_abstandard.html is a general purpose finite element program designed specifically for advanced structural and heat transfer analysis.
ABAQUS/Explicit http://www.hks.com/products/p_abexplicit.html is a finite element program designed specifically to serve advanced, nonlinear continuum and structural analysis needs.
Hygrometrix, Inc.
We design and manufacture high precision humidity and vapor sensing solutions for aerospace, industrial, research, environmental and scientific customers around the world
microTEC
microTEC offer the customer specific development and contract manufacturing of components, microsystems and microstructures, as prototyping as well as batch production.
Moxtek
Innovative x-ray components and optical polarizers x-ray products and optical polarizers
MOXTEK®, Inc. was founded in 1986 with technology jointly developed with Brigham Young University. Today, MOXTEK is a leader in the development and manufacturing of X-ray and optical components. Moxtek is well known for advanced technology, innovative solutions, and excellent customer service.
National Cheng Kung University
The Department of Mechanical Engineering at National Cheng-Kung University (NCKU) has been established since 1931, and is the oldest and the most renowned mechanical engineering institutes in Taiwan. Our alumni and alumnus occupy important positions in Taiwan’s industries, business, and governmental institution. In addition, numerous faculty members of Taiwan and world’s leading universities are also graduated from this department. A local survey reveals that alumni from NCKU have being the most welcome employees by Taiwan business companies. Each year, 150 undergraduate students, 171 master students (including 20 part-time students), and 60 Ph.D. students are enrolled in this department each year. Currently, this department is consisted of 47 full time professors, 11 adjunct professors, 600 undergraduates, 300 master students, and 150 Ph.D. students.
Pragmatic Instruments, Inc.
Pragmatic Instruments is a San Diego-based manufacturer of Arbitrary Waveform Generators, Voltage Standards, MEMS Driver Systems, and other custom signal generation products for novel test applications.
SIMODE/QSIMODE
The simulation package SIMODE/QSIMODE contains complete simulation support for orientation dependent etching. It is developed by GEMAC mbH http://www.gemac-chemnitz.de/ and the University of Chemnitz.
The MathWorks, Inc.
produces the MATLAB package, which may be used for general system simulation and visualization applications.
Top-Vu Technology,Inc.
from: http://www.mems-exchange.org/
AWR-APLAC develops and markets simulation and analysis software for analog and RF designers. The software is specially designed to meet the challenges of mobile communications. APLAC software is used by both multi-national companies as well as small design agencies to solve their most challenging simulation problems. APLAC enhances the cost effectiveness and shortens the design time. APLAC's capabilities range from integrated circuits to circuit board and system level design, from direct current to RF and microwave frequencies.
Bay Technology
Supplier of LinkCAD, a CAD Translation program for translation of GDS-II, DXF, Gerber, PostScript & CIF. Used for moving files from one program to another as you step through the manufacturing processes. Baytech is also a supplier of IE3D an Electromagnetic Simulation tool for analysis of MEMS circuits.
CFD Research Corporation (CFDRC)
Provides advanced software tools for modeling, simulation, and design of MEMS. Their software has been used for the analysis of a wide variety of physical phenomena such as fluid flow, heat transfer, combustion, and fluid-structure interaction. Industrial applications include MEMS, electronics packaging, semiconductor turbomachinery, and automotive engineering.
COMSOL Inc.
COMSOL MEMS Module addresses design issues that arise in the micro-world. It models physical phenomena in actuators and sensors plus microfluidic and small piezoelectric devices. Because MEMS Module is built over COMSOL Multiphysics platform it can handle electromagnetic- structural, thermal-structural, fluid-structure (FSI), electromagnetic-fluid interactions or any other combination of multiphysical couplings needed in the MEMS world.
Dolphin Integration
Our current mission is to supply our worldwide customers with fault-free, high-yield and reliable sets of CMOS Virtual Components, together with engineering assistance and product evolution customized to their needs.
Flow Science
Flow Science offers FLOW-3D, a leader free surface modeling accuracy, especially in cases where surface tension is dominant, as with microscale flows. With its fully-featured solver, FLOW-3D can be used to simulate a wide range of MEMS problems.
Hibbitt, Karlsson & Sorensen, Inc.
Produces the ABAQUS http://www.hks.com/products/ products for finite-element simulation.
ABAQUS/Standard http://www.hks.com/products/p_abstandard.html is a general purpose finite element program designed specifically for advanced structural and heat transfer analysis.
ABAQUS/Explicit http://www.hks.com/products/p_abexplicit.html is a finite element program designed specifically to serve advanced, nonlinear continuum and structural analysis needs.
Hygrometrix, Inc.
We design and manufacture high precision humidity and vapor sensing solutions for aerospace, industrial, research, environmental and scientific customers around the world
microTEC
microTEC offer the customer specific development and contract manufacturing of components, microsystems and microstructures, as prototyping as well as batch production.
Moxtek
Innovative x-ray components and optical polarizers x-ray products and optical polarizers
MOXTEK®, Inc. was founded in 1986 with technology jointly developed with Brigham Young University. Today, MOXTEK is a leader in the development and manufacturing of X-ray and optical components. Moxtek is well known for advanced technology, innovative solutions, and excellent customer service.
National Cheng Kung University
The Department of Mechanical Engineering at National Cheng-Kung University (NCKU) has been established since 1931, and is the oldest and the most renowned mechanical engineering institutes in Taiwan. Our alumni and alumnus occupy important positions in Taiwan’s industries, business, and governmental institution. In addition, numerous faculty members of Taiwan and world’s leading universities are also graduated from this department. A local survey reveals that alumni from NCKU have being the most welcome employees by Taiwan business companies. Each year, 150 undergraduate students, 171 master students (including 20 part-time students), and 60 Ph.D. students are enrolled in this department each year. Currently, this department is consisted of 47 full time professors, 11 adjunct professors, 600 undergraduates, 300 master students, and 150 Ph.D. students.
Pragmatic Instruments, Inc.
Pragmatic Instruments is a San Diego-based manufacturer of Arbitrary Waveform Generators, Voltage Standards, MEMS Driver Systems, and other custom signal generation products for novel test applications.
SIMODE/QSIMODE
The simulation package SIMODE/QSIMODE contains complete simulation support for orientation dependent etching. It is developed by GEMAC mbH http://www.gemac-chemnitz.de/ and the University of Chemnitz.
The MathWorks, Inc.
produces the MATLAB package, which may be used for general system simulation and visualization applications.
Top-Vu Technology,Inc.
from: http://www.mems-exchange.org/
ANSYS and MEMS
Microsystems (MEMS) Industry
Micro Electro Mechanical Systems (MEMS) technology is at the center of a rapidly emerging industry combining many different engineering disciplines & physics: electrical, electronic, mechanical, optical, material, chemical, and fluidic engineering disciplines. As the smallest commercially produced "machines," MEMS devices are similar to traditional sensors and actuators although much, much smaller. e.g. Complete systems are typically a few millimeters across, with individual devices and features of the order of 1-100 micrometers across.
Micro Electro Mechanical Systems (MEMS) technology is at the center of a rapidly emerging industry combining many different engineering disciplines & physics: electrical, electronic, mechanical, optical, material, chemical, and fluidic engineering disciplines. As the smallest commercially produced "machines," MEMS devices are similar to traditional sensors and actuators although much, much smaller. e.g. Complete systems are typically a few millimeters across, with individual devices and features of the order of 1-100 micrometers across.
Example of a MEMS switch, courtesy FEM-ware GmbHRF device. The response time of an electrostatic actuated beam is simulated. Actuation voltage, mechanical contact and fluid damping effects are simultaneously accommodated using our reduced order modellig (ROM) technique.
Microsystem Analysis Features
ANSYS Multiphysics has an extremely broad physics capability directly applicable to many areas of microsystem design. Coupling between these physics enables accurate, real world simulation of devices such as electrostatic driven comb drives. i.e.
- The ability to compute fluid structural damping effects is critical in determining the switching response time of devices such as micromirrors.
- Electro-thermal-structural effects are employed in thermal actuators.
- Fluid (CFD) capabilities are used to compute flow and free surface droplet formation useful in the design of ink-jet printer nozzles, and lab-on-chip applications.
The following diagram explains how ANSYS Multiphysics capabilities fits into your Microsystem/MEMS design process:
A sample of the features included in ANSYS Multiphysics are listed below:
- Structural static, modal, harmonic, transient mechanical deformation.
- Large deformation structural nonlinearities.
- Full contact with friction and thermal contact.
- Linear & non linear materials.
- Buckling, creep.
- Material properties: Temperature dependent, isotropic, orthotropic, anisotropic.
- Loads/Boundary conditions: Tabular, polynomial and function of a function loads.
- Plasticity, viscoplasticity, phase change.
- Electrostatics & Magnetostatics.
- Low Frequency Electromagnetics.
- High Frequency Electromagnetics. (Full wave, frequency domain).
- Circuit coupling - voltage & current driven.
- Acoustic - Structural coupling.
- Electrostatic-structural coupling.
- Capacitance and electrostatic force extraction.
- Fluid-Structural capability to evaluate damping effects on device response time.
- Microfluidics: Newtonian & non Newtonian continuum flow
- Free Surface VOF with temperature dependent surface tension.
- Charged particle tracing in electrostatic and magnetostatic fields.
- Electro-thermal-structural coupling.
- Piezoelectric & Piezoresistive transducers: Direct coupled structural-electric physics. Full isotropic, orthotropic parameters.
- Advanced themrolelectirc effect such as Seebeck, Peltier & thermocouple.
ANSYS MEMS Applications Overview
ANSYS Multiphysics can be applied to a broad range of Microsystem/MEMS analysis. The following table shows the analysis capability relevant for a range of applications. Select the application name or click the link in the "at a glance" section to the right to view a more detailed description.
from: http://www.ansys.com/
2007-10-08
University of Alberta - ANSYS Tutorials
These pages include some ANSYS examples including:
static/dynamic structural analysis (both linear and non-linear), heat transfer and fluid problems, as well as acoustic and electromagnetic problems.
http://www.mece.ualberta.ca/tutorials/ansys/
static/dynamic structural analysis (both linear and non-linear), heat transfer and fluid problems, as well as acoustic and electromagnetic problems.
http://www.mece.ualberta.ca/tutorials/ansys/
Some examples
From Kent L. Lawrence
please open the following links in the new windows
1. Introduction
1.A Solutions Format and Samples
1.B Solution Sequence & Files - Describes the steps in performing a solution and the files required or created.
2. Truss Examples
2.A Truss1 - Simple 2D truss.
2.B El type - Including multiple materials and cross sectional areas in a text file.
2.C Truss2 - 2D Truss with multiple element properties.
3. Plane Stress Examples
3.A Plane Stress - Stresses in plate with a hole.
3.B Areas - Interactive creation of area geometry.
3.C h_refine - Mesh refinement to increase the solution accuracy.
3.D p-Method - Solution accuracy control using higher order elements.
4. Axisymmetric Problems
4.A Thick Cylinder Cylinder Stress and Deformation
5. Three Dimensional Models
5.A 3D Cylinder 3D Model of Thick Cylinder
5.B Cyclic Symmetry Using symmetry to reduce problem size.
6. Heat Conduction & Axisymmetric Thermal Stress
6.A 2Dheat - Conduction / convection in a cylinder.
6.B Therm Stress - Thermal stresses in a vessel with spherical end caps.
7. Beam Examples
7.A Beam1 - Simple 2D Cantilever Beam.
7.B 'L' beam - Simple 3D Beam.
8. Plate Models
8.C Simply Supported Plate Example of shell element modeling
9. Natural Frequency & Normal Mode Calculation
9.A Truss Freq. - Natural frequencies of a simple truss.
9.B beamvib - 2D beam carrying non-structural masses.
10. Miscellaneous Topics
10.A Mapped Meshes - Creating meshes with specific properties.
10.B IGES - Transferring solid models from Pro/E to ANSYS.
10.C Materials Lib - Accessing the ANSYS materials library.
10.D Printing Results - Tips for obtaining hard copy of your results.
10.E Helpful Web Sites
please open the following links in the new windows
1. Introduction
1.A Solutions Format and Samples
1.B Solution Sequence & Files - Describes the steps in performing a solution and the files required or created.
2. Truss Examples
2.A Truss1 - Simple 2D truss.
2.B El type - Including multiple materials and cross sectional areas in a text file.
2.C Truss2 - 2D Truss with multiple element properties.
3. Plane Stress Examples
3.A Plane Stress - Stresses in plate with a hole.
3.B Areas - Interactive creation of area geometry.
3.C h_refine - Mesh refinement to increase the solution accuracy.
3.D p-Method - Solution accuracy control using higher order elements.
4. Axisymmetric Problems
4.A Thick Cylinder Cylinder Stress and Deformation
5. Three Dimensional Models
5.A 3D Cylinder 3D Model of Thick Cylinder
5.B Cyclic Symmetry Using symmetry to reduce problem size.
6. Heat Conduction & Axisymmetric Thermal Stress
6.A 2Dheat - Conduction / convection in a cylinder.
6.B Therm Stress - Thermal stresses in a vessel with spherical end caps.
7. Beam Examples
7.A Beam1 - Simple 2D Cantilever Beam.
7.B 'L' beam - Simple 3D Beam.
8. Plate Models
8.C Simply Supported Plate Example of shell element modeling
9. Natural Frequency & Normal Mode Calculation
9.A Truss Freq. - Natural frequencies of a simple truss.
9.B beamvib - 2D beam carrying non-structural masses.
10. Miscellaneous Topics
10.A Mapped Meshes - Creating meshes with specific properties.
10.B IGES - Transferring solid models from Pro/E to ANSYS.
10.C Materials Lib - Accessing the ANSYS materials library.
10.D Printing Results - Tips for obtaining hard copy of your results.
10.E Helpful Web Sites
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